Ka-Ro QS8M Series

QS8M-MQ00 / QS8M-ND00


QS8M Series



Configuration

Processor NXP i.MX 8M Mini/Nano
Cores Dual / Quad Core
Clock 1.6 / 1.4 GHz
RAM 1GB / 512MB DDR3L
Flash 4GB eMMC
Grade Industrial
Temperature -25°C to 85°C (eMMC)
Dimensions 27mm x 27mm x 2.3mm
Display Interface 1 x MIPI DSI 4-lane
Datasheet PDF-icon.png


QS8M

Our new QS8M Series is a QFN Style Solder-Down Computer On Module. The module with a small square size of 27mm and a height of 2.3mm is single-sided assembled. Its QFN type lead style has a 1mm pitch with 100 pads. The ground pad additionally acts as thermal pad.


TX8M Linux Development Kit

The TX8M development kit is mounted to a 10.1” TFT display for development and prototyping of industrial display applications.
 
TX8M-Linux-Dev-Kit.png
 
Linux is pre-installed and ready for application development. Other features include:
  •  Single 12VDC power supply
  • Mini-PCIe socket
  • RJ45 Ethernet connector
  • 3.5mm audio jack
  • 120-pin header expansion ports
  • MIPI-CSI camera interface on DF13
  • Micro SD-Card socket​

QFN Style COM Advantages

Since industrial applications lead to faster, higher integrated and lower power electronic circuits with a smaller formfactor, the PCB layout becomes more and more important. With a good layout many EMI problems can be minimized to meet the required specifications. It's not only the pinout which should lead to an easy wiring without the need for crossings. It has also to provide a proper solution for the signal path back to the module. If this return path, mostly the ground plane, cannot be connected near the signal pin, the return current has to take another way and this may result in a loop area.

With the special design of KaRo's QS8M Series you profit from different advantages.

  • Large ground pad on the bottom side makes a defined ground plane connection available for all signals.
  • The pinout leads to an easy wiring without crossing.
  • Ground will be connected near the signal pin to avoid loop areas.
  • High speed signals can be routed on the top layer at a defined impedance.
  • Ground pad holds the component at a defined height during soldering.

Module Connectivity

  • 1 Gb Ethernet (IEEE 1588, EE & AVB)
  • S/PDIF TX & RX
  • 5 x I²S/SAI
  • 1 x USB2.0 OTG & PHY
  • PDM
  • 4 x UART
  • 4 x I²C
  • 4 x PWM
  • 3 x SPI
  • 1 x MIPI CSI (4-lane) camera interface
  • 1 x MIPI DSI (4-lane) display interface
  • Up to 70 x 3.3V General Purpose I/O

Flexibility, high performance and easy integration



Ka-Ro QS8M: Target markets

Embedded computing power is very much in demand in a growing number of multimedia-centric devices. The Ka-Ro QS8M is ideally suited for target markets requiring high-end devices for powerful images and impressive video streaming creating connected devices in the following vertical markets.
  • Automation
  • Medical technology
  • Industrial control
  • Digital signage
  • Transportation

Processor Features

By combining the power-efficient processing capabilities of the ARM Cortex-A53 architecture with bleedingedge 3D and 2D graphics, the i.MX 8M Mini/Nano provides a new level of multimedia performance to enable an unbounded next-generation user experience.